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Samsung is really tired of the fact that its Exynos chips have a weaker performance compared to its competitors, and for this reason, it is trying to improve every day in this area. Now the Korean company plans to launch the Exynos 2400 for more serious competition.
Exynos 2400 chip configuration information shows that all 10 cores are not activated at the same time and instead the number of cores allocated for different tasks increases.
Previous rumors indicated that the Exynos 2400 will be manufactured based on Fo-WLP or Fan-out technology, which makes the chip packaging thinner and less power-efficient, but according to the announcement Fon Arena, it is possible to produce the aforementioned system-on-chip with the i-Cube process. Samsung says i-Cube is a heterogeneous integration technology that places one or more logic dies (CPU, graphics, etc.) and multiple high-bandwidth memories (HBM) horizontally on a chip.
The leaked benchmark score of Exynos 2400 shows that it has a performance at the level of Apple’s M2. Samsung’s Exynos chips are not very popular among users, and if the mentioned chip is going to provide more processing power and better energy efficiency, it should at least perform at the level of its peers, including Qualcomm’s Snapdragon 8 Gen 3, MediaTek’s Dimensity 9400, and Apple’s A17 Bionic.
In some previous rumors, it has been said that Exynos 2400 will be made of Cortex-X4 core with powerful performance, two Cortex A720 cores with high frequency, three Cortex A720 cores with lower frequency and finally four optimal Cortex A520 cores. Now it remains to be seen how the Exynos 2400 will perform in the real world if such specifications are true.
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