Qualcomm and MediaTek will soon heat up the mobile processor competition


The optimization process of the Snapdragon 8 Gen 3 and Dimensity 9300 processors continues, and new rumors say that the prototypes of these two flagship chips have experienced significant generational improvement.

The whistleblower who talked about the new flagship processors did not reveal the exact benchmark numbers, but said that Snapdragon 8 generation 3 and Dimensity 9300 are more powerful processors than Snapdragon 8 generation 2 and Dimensity 9200. It is likely that the new Qualcomm flagship will be unveiled after the Mediatek flagship.

Some whistleblowers say that Qualcomm is producing two different models of Snapdragon 8 Gen 3 that we don’t know the exact difference between. This system-on-chip will probably use a Cortex-X4 core in the CPU unit, along with five mid-range cores and two low-power cores. We have never seen such a strange arrangement in mobile processors.

to the writing of Wccftech, the Dimensity 9300 processor will probably be more powerful as rumors have pointed to this chip benefiting from four Cortex-X4 cores. The Chinese leaker says that the Cortex-X4 currently has a number of issues, but these issues will likely be fixed in production.

ARM’s Cortex-X cores have a lot of processing power, but they have faced overheating problems in each generation. As a result of overheating, the performance of the core decreases. The ARM can probably overcome the Cortex-X4 issues thanks to TSMC’s lithography.

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