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According to reports, Apple is considering changing the manufacturing process for the upcoming iPhone 15 Pro chips to a more cost-effective process that could reduce power efficiency but improve overall efficiency.
Apple is likely to introduce the A17 Bionic chip with TSMC’s 3nm lithography in the iPhone 15 series. The A16 Bionic and previous chips were manufactured using the 4nm process, and moving to the 3nm process will improve performance.
to report Apple Insider The A17 used in this year’s iPhone 15 Pro and iPhone 15 Pro Max is made from the N3B process, but next year’s A17 will switch to the more affordable N3E process, which may be less efficient.
As of December 2020, reports surfaced that Apple had placed an order with TSMC for full production of 3nm processors. TSMC has finalized the development of its 3nm process and it will likely be used in many of Apple’s new products. But the company may switch to a different chip manufacturing process, known as N3E.
The N3B process refers to a variant of TSMC’s 3nm process, which offers better performance and efficiency than previous generations, which typically includes higher transistor density and a higher number of EUV layers, allowing for smaller, more powerful chips.
On the other hand, the N3E process is another type of TSMC 3nm lithography that focuses on reducing manufacturing costs. While it may have a slightly lower transistor density and fewer EUV layers than the N3B process. The goal of the N3E process is to balance performance and cost.
Apparently, Apple will switch to the N3E process for the A17 chip in 2024. Another possibility is that Apple will use this process for the iPhone 16 series.
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