Taiwanese semiconductor giant TSMC has reportedly begun trial production of Apple’s advanced 3-nanometer chips, and mass production is likely to begin in the fourth quarter of next year. As usual, the people of Cupertino are expected to own most of the memory chip production lines solely because of their close ties to TSMC.
Now, a report from Digitimes, citing informed sources, indicates that Intel is also seeking to expand its relationship with TSMC in order to prevent possible tensions with Apple, in addition to taking over part of the advanced chip production line. In fact, the Blue Team wants to make sure that its 3nm GPUs and CPUs are produced without affecting the process of making Apple chips.
According to the report, Intel executives plan to visit Taiwan and TSMC in mid-December to discuss production and production capacity of the chips. Evidence shows that Intel is looking to use the Taiwanese 3nm process for Meteor Lake series processors. Currently, the company is lagging behind in the transition to advanced in-house chip manufacturing processes and outsourcing to third-party vendors such as TSMC is the fastest way Intel has tackled Apple and AMD chips.
The report comes as some sources claim that Apple will equip the next generation Imec Pro with a Max Deo’s Amoone chip consisting of two die. As the name implies, it is expected to consist of two M1 Max chips and on paper promises double performance improvements.
The chip can have a maximum of 128 GB of RAM, which is actually twice as much as the latest MacBook Pro configuration. However, the chip does not appear to be manufactured by the 3-nanometer manufacturing process. Apparently, Apple has planned its most powerful chips for 2023, some of which will be made with the TSMC three-nanometer process, which will consist of 4 dice.
In addition, it is not yet clear what process the next generation A-series chip will be made of. Revealers claim that Apple may use 5-nanometer lithography for the third year in a row to produce the A16 Bionic chip, and some believe that the chip will be made like the new Snapdragon flagship chip with 4-nanometer lithography.